Empirical study on learning curves in logistics management systems

Authors

  • Yalili Rodríguez Romero Universidad Central Marta Abreu de las Villas
  • Roberto Cespón Castro Universidad Central Marta Abreu de las Villas
  • Nelson Javier Tovar Perilla Universidad de Ibagué

Keywords:

SCOR model, Supply chain, Learning curve, Logistics management system

Abstract

Learning curves have been frequently applied in production/operations management and various logistics processes in many manufacturing and service organizations. However, studies on their integral use in the supply chain are recent. This paper contributes to filling this knowledge gap by measuring the impact of learning on lead time in logistics management systems. The empirical study was used as a methodological tool to demonstrate this. The logarithmic-linear models were applied to three case studies representative of the logistics systems proposed by the Supply Chain Operations Reference (SCOR) model: make-to-order, make-to-stock, and engineer-to-order. The first two were adjusted to the Stanford model and the third to De Jong’s model. Their learning curve, mathematical equations, and sensitivity analysis were determined, demonstrating the approach's relevance and difference compared to previous publications, which mainly analyze parts of the supply chain.

 

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Author Biographies

Yalili Rodríguez Romero, Universidad Central Marta Abreu de las Villas

Universidad Central Marta Abreu de las Villas. Departamento de Ingeniería Industrial. Villa Clara, Cuba

Roberto Cespón Castro, Universidad Central Marta Abreu de las Villas

Universidad Central Marta Abreu de las Villas. Departamento de Ingeniería Industrial. Villa Clara, Cuba

Nelson Javier Tovar Perilla, Universidad de Ibagué

Universidad de Ibagué. Departamento de Ingeniería Industrial. Ibagué, Colombia

Published

2024-10-28

How to Cite

[1]
Y. Rodríguez Romero, R. Cespón Castro, and N. J. Tovar Perilla, “Empirical study on learning curves in logistics management systems”, Ingeniare, Rev. chil. ing., vol. 30, no. 4, Oct. 2024.

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