Morphology evolution of ZnO/dye thin films by cathodic electrodeposition and their properties

Authors

  • Mónica Moya Universidad Sergio Arboleda
  • Bernabé Marí Universidad Politécnica de Valencia
  • Miguel Mollar Universidad Politécnica de Valencia

Keywords:

Cathodic electrodeposition, ZnO/N719, thin films, nanopores films, growth mechanism

Abstract

Thin films of Zinc Oxide (ZnO) were grown on glass substrates conductive FTO (Fluorine-doped tin oxide)
with a thickness of 400 nm. The hybrid films of ZnO and dye (N719) were grown on FTO conductive glass
to a thickness of 600 nm. The growth of hybrid films of ZnO / N719 was made by two steps, cathodic
electrodeposition and diping. The effect of increasing the temperature for growth of the hybrid films to
80 oC allows absorption of the dye in the fixed structure of ZnO, completely modifying the ZnO structure of
hexagonal wirtzita to be evaluated using the Scanning Electron Microscope (SEM) and X-ray diffraction
(XRD). Morphological response study by Scanning Electron Microscope (SEM) showed that it is possible
to obtain pores with a diameter <350 nm in the structure of ZnO completely changing its hexagonal shape. The response of optical properties in the hybrid ZnO films / N719, proved to be found two peaks
of absorption in the spectrum, 340 nm and 660 nm when a metal-X adheres to the structure of ZnO.

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Author Biographies

Mónica Moya, Universidad Sergio Arboleda

Escuela de Ciencias Exactas e Ingeniería. Universidad Sergio Arboleda. Calle 74 n 14-14. Bogotá, Colombia.

Bernabé Marí, Universidad Politécnica de Valencia

Departamento de Física Aplicada. Universidad Politécnica de Valencia. Cami de Vera s/n 46022l. Valencia, España.

Miguel Mollar, Universidad Politécnica de Valencia

 Departamento de Física Aplicada. Universidad Politécnica de Valencia. Cami de Vera s/n 46022l. Valencia, España.

Published

2024-10-28

How to Cite

[1]
M. Moya, B. Marí, and M. Mollar, “Morphology evolution of ZnO/dye thin films by cathodic electrodeposition and their properties”, Ingeniare, Rev. chil. ing., vol. 27, no. 2, Oct. 2024.

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