Transdisciplinary and responsible research and innovation in firms: a proposal for integration

Authors

  • Graciela Salgado Escobar Instituto Politécnico Nacional
  • Mario Aguilar Fernández Instituto Politécnico Nacional

Keywords:

Transdisciplinary, Commitment, Competences

Abstract

Faced with the need to generate knowledge that transfers the disciplinary vision and the development of research and responsible innovation (RRI), the objective of this research is to design a transdisciplinary process that integrates the approach of RRI in companies to strengthen the commitment and development of higher-order objectives for both the individual and society. The research is qualitative, of a documentary type, and it is carried out in two phases: the first consists of a review of the frontier of knowledge concerning the TD and the RRI, in publications of the last five years, in the web of science. In the second, the TD-RRIE process is configured based on the soft systems methodology, holistic theory, stage-gates methodology, and competence approach. The process consists of four moments through which it seeks to promote ethical and socially acceptable actions. Also, the process is intended to ensure that the organization conceives RRI as an integrated thought pattern to observe reality and influence society in general.

 

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Author Biographies

Graciela Salgado Escobar, Instituto Politécnico Nacional

Instituto Politécnico Nacional. Unidad Profesional Interdisciplinaria de Ingeniería y Ciencias Sociales y Administrativas - Departamento de Estudios Profesionales Genéricos. CDMX, México

Mario Aguilar Fernández, Instituto Politécnico Nacional

Instituto Politécnico Nacional. Unidad Profesional Interdisciplinaria de Ingeniería y Ciencias Sociales y Administrativas - Sección de Estudios de Posgrado e Investigación. CDMX, México

Published

2024-12-19

How to Cite

[1]
G. Salgado Escobar and M. Aguilar Fernández, “Transdisciplinary and responsible research and innovation in firms: a proposal for integration”, Ingeniare, Rev. chil. ing., vol. 31, Dec. 2024.

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